US DoD and Intel Launch RAMP-C Era of Chips

Two and a half years after the launch of the Rapid Assured Microelectronics Prototypes (RAMP-C) program in collaboration with the Pentagon, Intel has strengthened its partnership with the US Department of Defense. Intel, the Pentagon, and the Accelerated Development Program for National Security, funded by the Chips Act, have agreed to collaborate on producing prototypes using the latest technological processes for chip manufacturing, a capability previously only available in Europe and Asia.

Through the RAMP-C program, the US government will gain access to advanced technologies for microprocessor production. The third stage of the program will involve creating prototypes using Intel’s 18A technological process, typically used for consumer processors that require high energy consumption for resource-intensive calculations and graphics.

Intel’s partnerships with defense industry companies like Northrop Grumman and Boeing include the production of 18A chips for national security needs. Additional collaborators with Intel in developing new technology include Microsoft, Nvidia, and IBM.

The 18A chips represent the next generation of Intel microchips following the 20-angstrom chips set to enter mass production in 2024. Last year, Intel’s CEO Patrick Gelsinger revealed details of the 18A process, noting that development was ahead of schedule.

According to Intel’s roadmap dated December 2022, risky production of 18A chips could begin in the second half of 2024. Gelsinger praised the energy efficiency of the 18A chips, stating they outperform TSMC’s 2-nanometer process. The 18A process corresponds to 1.8 nanometers, representing a significant advancement in chip technology.

In the final phase of the RAMP-C program, Intel’s Foundry division will focus on microcircuit topology design, a crucial step before manufacturing photomasks for high-tech production equipment. Intel recently inaugurated a state-of-the-art system for chip production using extreme ultraviolet lithography, which is expected to streamline processor manufacturing processes.

/Reports, release notes, official announcements.