China is actively studying the possibilities of its own high bandwidth memory (HBM) chips for artificial intelligence processors, as part of its efforts to achieve independence and self-sufficiency in the semiconductor industry amidst growing American sanctions.
While catching up with world leaders in the industry like SK Hynix, Samsung, and Micron may not be easy due to the influence of American sanctions, the Chinese government believes that the country should strive to be self-sufficient in HBM production, even if it takes several years.
Industry sources indicate that Changxin Memory Technologies (CXMT), the largest manufacturer in China, has the best chances of creating its own HBM chips. However, it may take up to 4 years for the product to reach mass production.
Preliminary forecasts suggest that the demand for HBM chips will grow by almost 60% in 2023, driven by the rapid development of neural network models and the significant capacities required for training.
Recently, we reported that Chinese company Huawei may soon unveil its own GPU that rivals NVIDIA’s advanced developments. With its own production of high-speed memory chips, China will move closer to achieving complete technological independence in the field of AI and machine learning.
In summary, China is actively striving for sovereignty in the semiconductor industry and HBM chips represent another step towards this goal, despite the current technological lag behind market leaders.